Two-component thermal conductive silicone gel
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The 5100 Series is a high-thermal-conductivity two-component silicone gel. Mixed 1:1 during application, it cures at room temperature or can be accelerated by heat. It releases no gases and is commonly used to fill gaps between heat-generating components. After curing, it eliminates assembly tolerances. Since it vulcanizes after dispensing and assembly, it effectively reduces stress damage to components. Its automated dispensing design enhances operational efficiency, enabling automated assembly and offering high adaptability as a thermal interface material.
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