Heat sink: Typically made of metals such as aluminum or copper, which have good thermal conductivity. The chips in a server, such as the CPU, GPU, etc., generate a lot of heat when running, and the heat sink, by being in close contact with the chip surface, can quickly conduct the heat away, and then the heat is dissipated into the surrounding air through wind cooling methods such as fans, to prevent the chip from performance degradation or damage due to excessive heat.4.
Heat pipe: is an efficient heat conduction element, which is filled with special working liquid inside. It uses the principle of phase change of liquid to transmit heat. When one end of the heat pipe is heated, the liquid evaporates and flows to the other end, where it condenses and releases heat. Through this cycle process, the heat generated by the server hardware can be quickly transferred from the heating source to the cooling end, effectively improving the heat dissipation efficiency. It is often used for heat dissipation of server components with high power density.4.
Thermal grease, thermal paste: These materials have high thermal conductivity and good insulation performance, used to fill the tiny gaps between the chip and the heat sink, which can significantly reduce the contact thermal resistance, allowing heat to be transferred from the chip to the heat sink more smoothly, thus improving the cooling effect and ensuring the stability of server hardware under high-load operation8.
Water cooling system: Water cooling is one of the cooling methods commonly used in large data centers. Water, as a cooling medium, has the characteristics of large specific heat and good thermal conductivity. Through the water cooling pipeline cycle, it can absorb a large amount of heat generated by the equipment such as servers, and then bring the heat to the cooling tower or cold water unit for heat dissipation, effectively reducing the temperature of the data center, which is suitable for data centers with high power density.4.
Liquid cooling systems: Besides water, some special coolants such as fluorine-based liquids are also widely used. Fluorine-based liquids have excellent thermal conductivity, low viscosity, and high boiling points, which can achieve more efficient cooling in a smaller space, especially suitable for high-density servers and high-performance computing environments, to meet the cooling needs of high-performance computing equipment in data centers.4.
Phase change material cooling: Phase change materials (PCMs) are a new type of cooling material that can absorb and release a large amount of heat through phase change processes. In data centers, phase change materials can be used to store the heat generated by servers. When the temperature rises to the phase change point, the material absorbs heat and undergoes a phase change, thus delaying the rate of temperature rise and achieving efficient cooling, which can reduce the energy consumption of the cooling system to a certain extent.4.