Single-component thermal conductive silicone gel
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The 5200 Series Thermal Conductive Silicone Gel, also known as thermal paste or thermal compound, is formulated with silicone resin as its base material, enhanced with thermal conductive fillers and bonding agents. It exhibits superior resistance to high and low temperatures, low mechanical stress, and excellent compression set properties. This product offers outstanding weather resistance, radiation resistance, and superior dielectric properties, with no volatile components. It is suitable for filling surface gaps in various microwave components such as microwave communication equipment, microwave transmission devices, microwave-specific power supplies, and regulated power supplies. It provides excellent thermal conductivity for heat-generating electronic components.
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